Plasma and CVD Process Monitoring

Plasma and CVD Process Monitoring

Plasma Etch, Chemical Vapor Deposition (CVD) and Plasma-Enhanced Chemical Vapor Deposition (PECVD) applications require a thorough understanding of the complex chemistries involved in the processes. Also critical to the processes is the ability to monitor low-level components.

For plasma applications, scientists choose Extrel MAX and MAX-LT™ Flange Mounted Mass Spectrometers. These detection systems offer high performance and speed with the capability to perform energy analysis.

High sensitivity and high abundance sensitivity enables monitoring of very low partial pressure components within a high background. Ions, radicals, and neutrals can be measured as well. Extrel’s Plasma Analysis System can work with processes up to atmospheric pressure.

System Specs

The MAX and MAX-LT Flange Mounted Mass Spectrometers feature:

  • High Sensitivity to 6 mA/Torr
  • High Resolution up to 3000 M/delta-M at mass 40
  • High Abundance Sensitivity to 107
  • Partial Pressure Detectability to 10-16 mbar
  • Energy Resolution down to 0.5eV
  • Various Mass Ranges from 1-60 and 2-1000 amu
  • Axial and right angle configurations
  • Positive and Negative Ion, and Neutral Detection

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